From March 5th to 7th, Hyteraems is going to participate in OFC 2019, the largest global conference and exhibition for optical communications and networking professionals, at San Diego Convention Center in California.
During the exhibition, we will demonstrate the latest technology capabilities, which includes the newly developed Die Attach and Wire Bonding, and quality management system for optical communications industry.
This year, however, we are going to make the seventh appearance in OFC under a fresh brand ── HiTG. We will soon switch to the new brand officially, which is a brand-leveled upgrade and the business entity remains unchanged.
Welcome to visit our booth # 5101.